After 8 years personal taining and technology accumulation£¬the development team from the initial 5 to 300. Now it has the collection product development, raw material procurement, market information collection, roduction of high-tech companies. 21 technical staff directly involved in product development , including 6 product development engineers , 18 or higher qualifications, the business development team for more than 10 years of senior hardware engineer team; Manufacturing factory has nearly 300 high-quality staff. The main business£º3C£¨computer¡¢consumer¡¢communication £©¡¢Industry,Public works¡¢Toys'electronic product development and design £»PCB design¡¢copy and manufacture£»Pilot production£»IC sales and matching components procurement£»product manufacturing¡£
Product development and production cases:
1¡¢Computer peripheral products £¨Road¡¢Network and telephone exchanged¡¢Bluetooth products etc£©¡¢DVB¡¢DVD¡¢MP3/MP4 etc£»
2¡¢Electronic refrigerators¡¢Fans¡¢Heater¡¢Humidifier¡¢Coffee pots¡¢Tea Machie¡¢Boiling pots¡¢Blenders¡¢Electric cooker¡¢Power switched¡¢Power interface and so on£»
3¡¢LED PV ligting system¡¢Generator control panel¡¢Xianqiege control board£»
4¡¢Lithium battery charging board¡¢Mobile phone main board¡¢Wire/wireless telephone main board etc £»
Printed Circuit Board
Item |
Mass processing capability |
Small batch processing capability |
Layer (Max.) |
2-28 |
26-32 |
Type of the board material |
FR-4, high TG board, aluminum board Rogers, etc., F4, BT |
Rogers,etc |
|
PTFE£¬PPO £¬PPE |
E-65£¬ect |
|
Compound pressed board |
4 layers 6 layers |
6 layers 8 layers |
Maximum Size |
610mm X 1100mm |
|
Outline Size Tolerance |
¡À0.13mm |
¡À0.10mm |
V-CUT Deepness Tolerance |
+/- 0.15 mm (V-CUT) £º+/- 0.1 mm (CNC V-CUT) |
BoardThicknessRange |
0.1mm--6.00mm |
0.10mm--8.00mm |
Board Thickness Tolerance( t¡Ý0.8mm) |
¡À8% |
¡À5% |
Board Thickness Tolerance (t£¼0.8mm) |
¡À10% |
¡À8% |
Medium Thickness |
0.076mm--6.00mm |
0.076mm--0.100mm |
Minimum Line Width |
0.75mm£¨3mil£© |
0.063mm(2.5mil) |
Minimum Line Distance |
0.75mm£¨3mil£© |
0.063mm(2.5mil) |
Line Margin |
0.2 mm £¨CNC£© £º0.30 mm (Æ¡°å)£º 0.50 mm (V-CUT) |
Outer layer copper thickness |
8.75um--1050um |
8.75um--1050um |
Inner layer copper thickness |
8.75um--1050um |
8.75um--1050um |
Drill hole size (power drill) |
0.25mm--6.00mm |
0.15mm--0.25mm |
Hole size (power drill) |
0.20mm--6.00mm |
0.10mm--0.15mm |
Hole size tolerance (power drill) |
+/- 0.08 mm (copper immersion hole) +/- 0.05 mm (non- copper immersion hole) +0.1/-0.05 mm (injection hole) |
Hole position deviation (power drill) |
+/-0.075mm: (drill hole) : +/- 0.10 mm (injection hole) |
0.050mm |
Laser hole size |
0.10mm |
0.075mm |
Aspect Ratio |
12.5£º1 |
20£º1 |
Solder mask type |
sensitive green, yellow, black, purple, blue ink |
Minimum width of solder mask bridge |
0.10mm |
0.075mm |
Minimum size of solder mask separation ring |
0.05mm |
0.025mm |
Taphole diameter |
0.25mm--0.60mm |
0.60mm-0.80mm |
Impedance tolerance |
¡À10% |
¡À5% |
Surface processing type |
HAL, plating nickel, thick & hard/soft metal, chemical nickel, lead-free tin immersion, lead-free H.A.S.L, Entek) |
|
|
Chinese
